3D Integration Handbook Volume 3 Three-Dimensional Process Technology(Chinese Edition)

[ MEI ] FEI LI PU&amp#183; JIA LUO ( Philip Garrou ) . [ RI ] XIAO LIU GUANG ZHENG ( Mitsumasa Koyanagi ) . [ DE ] BI DE&amp#183; LA MU ( Peter Ramm ) . WU DAO WEI . WANG WEI . LIU JIAN JUN . YU HUAN DENG YI

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HardCover.Pub Date:2022-10 Pages:369 Language:ChinesePublisher:China Aerospace PressSelf-operated3D Integration Handbook Volume 3 Three-Dimensional Process Technologyis divided into 22 chapters. namely: 3D IC integration since 2008. main applications and market trends of 3D integration and interposer technology. economic drivers and barriers to 2.5D/3D integration. interposer technology. TSV manufacturing overview. TSV unit process and integration. TSV preparation of ASET. laser-assisted wafe.

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Detalles bibliogr�ficos

T�tulo: 3D Integration Handbook Volume 3 Three-Dimensional Process Technology(Chinese Edition)
Idioma: Ingl�s
Encuadernaci�n: Hardcover
Estado: New

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