Fluid Flow, Heat Transfer And Boiling In Micro-channels

Yarin, L. P., Mosyak, A., Hetsroni,

ISBN 10: 3540787542 ISBN 13: 9783540787549
Editorial: Springer, 2008
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The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.

Acerca del autor: Dr. Yarin is Visiting Professor of Faculty of Mechanical Engineering at the Technion -Israel Institute of Technology. He received his MS degree from Polytechnic Institute of Kharkov in 1952, his Candidate of Technical Sciences (Ph.D)degree from Institute of Energetics Acad. Of Kazakhstan in 1962 and his Doctor of Technical Sciences degree from the Institute of High Temperatures Acad. Sci. USSR in 1970. He is the author of about . 200 research works (including 5 monographs) in the fields of the Combustion Theory, Heat and Mass Transfer, Two-Phase Flows, Turbulent Flows, Energetics, Aircraft and Rocket Engines, Experimental Method in Gas Dynamics and Heat Transfer, Thermoanemometry, High Temperature Combustion Reactors and Microfluid Mechanics. The research activities of Professor Yarin have focused on detailed analysis of aerodynamics and thermal regimes of combustion in gas torches, gas, liquid fuels and coal combustion, combustion waves propagations in porous and bubbly media aerodynamics of furnaces and combustion chambers of jet and rocket engines, gasodynamics of jet flows, hydrodynamics of stratified flows, magnetohydrodynamics, turbulent two-phase flows, as well as the theory of chemical reactors, microfluid mechanics, in particular heat and mass transfer in micro-channels. He was Professor, Heat and Chair of Engineering Thermal Physics in Ukta Industrial Institute, where teaching undergraduate and graduate courses in Hydrodynamics, Heat and Mass Transfer, Thermodynamics. He is also teaching in Technion - Israel Institute of Technology undergraduate, graduate and Ph.D course "Principles of Combustion of Two-Phase Media." Dr Mosyak is Research Fellow, Senior A of Faculty of Mechanical Engineering, Technion, Haifa, Israel. He received his MS degree from Polytechnic Institute of Odessa in 1960, his Candidate of Technical Sciences (Ph.D) degree from Polytechnic Institute of Odessa in 1972. He is the author of about 100 research works in the field turbulent flows, two-phase flows, heat and mass transfer, microfluid mechanics and thermodynamics. He was Associate Professor of Energy Engineering, Kishinev Polytechnic Institute, USSR where teaching undergraduate and graduate courses in Hydrodynamics, Heat and Mass Transfer, Thermodynamics. Dr. Hetsroni is Danciger Professor of Engineering, Faculty of Mechanical Engineering at Technion - Israel Institute of Technology. He received his B.Sc. Cum Laude, Technion, I.I.T. in 1957, and got Ph.D from Michigan State University in 1963. He was with the Atomic Power Division of Westinghouse for a couple of years before joining the Faculty at the Technion in 1965; since 1974 he is Danciger Professor of Engineering. In the U.S.A. he held positions also with the Electric Power Research Institute. At the Technion he has served as Dean of Mechanical Engineering, and as Head of the Neaman Institute for Advanced Studies. He was also Head of the National Council for Research and Development of Israel. He was Visiting Professor at Carnegie Mellon University, Stanford University, the University of California-Santa Barbara, the University of Minnesota and the University of New South Wales. He was the Vice President for Region XIII of the ASME International and was a Governor of the ASME. He is a Chief Editor of the International Journal of Multiphase Flow. He is the author of about 250 research works (including 5 monographs) in the fields of Multiphase flow and heat transfer, Experimental and computational fluid mechanics and heat transfer, Turbulent Flows, Thermal-hydraulic design of nuclear reactors, Turbulent Boundary layers, Boiling and Steam Generators. The research activities of Professor Hetsroni have focused on detailed analysis Aerodynamics Two-Phase Turbulent Jets, Particle Turbulent Interactions, Heat Transfer in Two-Phase Turbulent Boundary Layer, Coherent Structure of turbulent Flows, Direct Numerical Simulations of Turbulent Flows, Boiling of Surfactant Solution, Heat and Mass Transfer in Microchannels, as well as PIV (Particle Image Velocimetry) and Hot-Foil InfraRed Imaging (HFIRI) measurements in a flume. At present he is the Chief of the Multiphase Flow Laboratory of Technion. (http://techunix.technion.ac.il/multiphaselab)

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Título: Fluid Flow, Heat Transfer And Boiling In ...
Editorial: Springer
Año de publicación: 2008
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Yarin, L. P.; Mosyak, A.; Hetsroni, G.
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Condición: Sehr gut. Zustand: Sehr gut | Seiten: 496 | Sprache: Englisch | Produktart: Bücher | The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems. Nº de ref. del artículo: 4355708/12

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L. P. Yarin|A. Mosyak|G. Hetsroni
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Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Micro-channels are the future for cooling all types of circuits Thermodynamics is the key factor for designing effective coolersDr. Yarin is Visiting Professor of Faculty of Mechanical Engineering at the Technion -Israel Institute of Te. Nº de ref. del artículo: 4901029

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Buch. Condición: Neu. Fluid Flow, Heat Transfer and Boiling in Micro-Channels | L. P. Yarin (u. a.) | Buch | Heat and Mass Transfer | xiv | Englisch | 2008 | Springer | EAN 9783540787549 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. Nº de ref. del artículo: 101831389

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Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 496 pp. Englisch. Nº de ref. del artículo: 9783540787549

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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems. Nº de ref. del artículo: 9783540787549

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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems. 496 pp. Englisch. Nº de ref. del artículo: 9783540787549

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