Electronic Packaging Materials and Their Properties. Este artículo no está disponible.
Pecht, Michael; Agarwal, Rakish; McCluskey, F. Patrick; Dishongh, Terrance J.; Javadpour, Sirus; Mahajan, Rahul
Idioma: inglés
Editorial: CRC Press, 1998
- Tapa dura
- Nuevo
Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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Condición: Nuevo
EUR 300,85
Descripción del artículo del vendedor
In English.
N° de ref. del artículo ria9780849396250_new
- Título
- Electronic Packaging Materials and Their Properties
- Autor
- Pecht, Michael; Agarwal, Rakish; McCluskey, F. Patrick; Dishongh, Terrance J.; Javadpour, Sirus; Mahajan, Rahul
- Editorial
- CRC Press
- Año de publicación
- 1998
- Estado
- New
- Encuadernación
- Encuadernación de tapa dura
- Idioma
- inglés
- ISBN 10
- 0849396255
- ISBN 13
- 9780849396250
- Peso del artículo
- 474 gramos
- Serie
- Libro 3 de 4: Electronic Packaging
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
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