Chemical-Mechanical Planarization Volume 867: Integration, Technology and Reliability. Este artículo no está disponible.
Johns, E. C. & A. Kumar & J. A. Lee & Y. S. Obeng & I. Vos
Idioma: inglés
Editorial: Materials Research Society, 2005
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Librería: True Oak Books, Highland, NY, Estados Unidos de AmericaTrue Oak Books
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MRS Proceedings; 0 X 0 X 0 inches; In shrink wrap! No visible defects. Appears never read. ; - Your satisfaction is our priority. We offer free returns and respond promptly to all inquiries. Your item will be carefully cushioned in bubble wrap and securely boxed. All orders ship on the same or next business day. Buy with confidence.
N° de ref. del artículo TOB224-60469-A-4.61
- Título
- Chemical-Mechanical Planarization Volume 867: Integration, Technology and Reliability
- Autor
- Johns, E. C. & A. Kumar & J. A. Lee & Y. S. Obeng & I. Vos
- Editorial
- Materials Research Society
- Año de publicación
- 2005
- Estado
- Near Fine
- Sobrecubierta
- No Dust Jacket
- Encuadernación
- Hardcover
- Idioma
- inglés
- ISBN 10
- 1558998209
- ISBN 13
- 9781558998209
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
“Sinopsis” puede pertenecer a otra edición de este título.
Reseña del editor
Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.
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