Carbon Nanotubes for Interconnects : Process, Design and Applications

Todri-sanial, Aida (EDT); Dijon, Jean (EDT); Maffucci, Antonio (EDT)

ISBN 10: 3319806424 ISBN 13: 9783319806426

Editorial: Springer, 2018

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This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Acerca del autor: Aida Todri-Sanial is a research scientist at the French National Center for Scientific Research (CNRS) attached to Laboratoire of Informatique, Robotique, Microelectronics of Montpellier (LIRMM) in junction with University of Montpellier 2, France. She is also a permanent faculty member in the Microelectronics department at LIRMM. She received her Ph.D. in Electrical & Computer Engineering at the University of California Santa Barbara, USA in 2009. She received the B.S. and M.S. degrees from Bradley University, IL, USA and California State University at Long Beach, CA, USA in 2001 and 2003, respectively. From August 2009 to September 2010, she was with the Computing Division at Fermilab, IL, USA where she was the recipient of John Bardeen Fellowship Award. Previously, she has held several summer and visiting research positions: STMicroelectronics, FR (2008), IBM TJ Watson Research Center, Yoktown, NY, USA (2006, 2007), Mentor Graphics Corporation, CA, USA (2005), and Cadence DesignSystems, CA, USA (2002-2004).

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T�tulo: Carbon Nanotubes for Interconnects : Process...
Editorial: Springer
A�o de publicaci�n: 2018
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Carbon Nanotubes for Interconnects (eng)

Todri-Sanial, Aida

Publicado por Springer Vieweg, 2018

ISBN 10: 3319806424 ISBN 13: 9783319806426

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Carbon Nanotubes for Interconnects

Todri-Sanial, Aida|Dijon, Jean|Maffucci, Antonio

Publicado por Springer International Publishing, 2018

ISBN 10: 3319806424 ISBN 13: 9783319806426

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Condici�n: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a single-source reference on carbon nanotubes for interconnect applicationsIncludes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnectsCovers topics from modeling, simulation, analysis, desi. N� de ref. del art�culo: 448755693

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Carbon Nanotubes for Interconnects | Process, Design and Applications

Aida Todri-Sanial (u. a.)

Publicado por Springer International Publishing, 2018

ISBN 10: 3319806424 ISBN 13: 9783319806426

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Carbon Nanotubes for Interconnects

Aida Todri-Sanial

Publicado por Springer International Publishing, Springer International Publishing Mai 2018, 2018

ISBN 10: 3319806424 ISBN 13: 9783319806426

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Taschenbuch. Condici�n: Neu. Neuware -This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 348 pp. Englisch. N� de ref. del art�culo: 9783319806426

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Carbon Nanotubes for Interconnects : Process, Design and Applications

Aida Todri-Sanial

Publicado por Springer International Publishing, Springer International Publishing, 2018

ISBN 10: 3319806424 ISBN 13: 9783319806426

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Taschenbuch. Condici�n: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. N� de ref. del art�culo: 9783319806426

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Carbon Nanotubes for Interconnects

Aida Todri-Sanial

Publicado por Springer International Publishing Mai 2018, 2018

ISBN 10: 3319806424 ISBN 13: 9783319806426

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Taschenbuch. Condici�n: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. 348 pp. Englisch. N� de ref. del art�culo: 9783319806426

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