Big Data Analysis and Deep Learning Applications: Proceedings of the First International Conference on Big Data Analysis and Deep Learning (Advances in Intelligent Systems and Computing, 744)

Editor

Springer

Fecha de publicaci�n

2018

Idioma

Ingl�s

ISBN 10

9811308683

ISBN 13

9789811308680

Encuadernaci�n

Encuadernaci�n de tapa blanda

Estado

New

Cat�logos de vendedores

Acerca de

Sinopsis

This book presents a compilation of selected papers from the first International Conference on Big Data Analysis and Deep Learning Applications (ICBDL 2018), and focuses on novel techniques in the fields of big data analysis, machine learning, system monitoring, image processing, conventional neural networks, communication, industrial information, and their applications. Readers will find insights to help them realize more efficient algorithms and systems used in real-life applications and contexts, making the book an essential reference guide for academic researchers, professionals, software engineers in the industry, and regulators of aviation authorities.

Acerca del autor

Thi Thi Zin received her Ph.D. degree in the field of Image Processing in 2007 from Osaka City University, Japan. From 2007 to 2009, she was awarded a postdoctoral research fellowship of Japan Society for the Promotion of Science (JSPS). After the JSPS, she worked as a specially appointed researcher and specially appointed assistant professor at the University of Tokyo and Osaka City University until 2013. In 2016, she became a professor at the Faculty of Engineering, University of Miyazaki, Japan. Her research interests include human behavior understanding, intelligent transportation systems, cow behavior analysis, health care monitoring systems, and image recognition. She is a member of IEEE.

Jerry Chun-Wei Lin is currently an associate professor at the School of Computer Science and Technology, Harbin Institute of Technology (Shenzhen), China. He has published more than 200 research papers (90 SCI papers) and international conferences. His research interests include data mining, soft computing, artificial intelligence, social computing, multimedia and image processing, and privacy-preserving and security technologies. He is the Editor-in-Chief of the journal Data Science and Pattern Recognition (DSPR), associate editor of Journal of Network Intelligence, associate editor of Journal of Internet Technology (JIT), and the editorial board member of Intelligent Data Analysis (IDA). He is also the leader of SPMF project, which provides more than 130 data mining algorithms and has been widely cited in many different applications.

"Sobre este t�tulo" puede pertenecer a otra edici�n de este libro.

Descripci�n de la librer�a

50+ Million Books in stock & ready to ship! Excellent Prices, Service & Selection.

Ver la p�gina web de la librer�a

Informaci�n empresarial del vendedor

Condiciones de venta y env�o

Condiciones de venta

When you see an item on our listing, it means we have it available in one of our warehouses right here right now, ready for same day or next day processing of your order. Over 50+ Million books in stock & ready to ship same day. Customer Service is a top priority for us, we want every customer to be 100% satisfied. We offer the world's largest selection of books, music and video. Maintaining an accurate inventory of more than 50+ Million items, we are able to ship your order the same day it is r...

M�s informaci�n

Derecho a cancelaci�n

Condiciones de env�o

SUPER FAST SHIPPING!

Tarifas de env�o en Estados Unidos de America

Tarifas de env�o en Estados Unidos de America
Cantidad del pedido	De 1 a 3 d�as h�biles	De 1 a 3 d�as h�biles
Primer art�culo	EUR 7.65	EUR 17.03

Los plazos de entrega los establecen los vendedores y var�an seg�n el transportista y la ubicaci�n. Los pedidos que pasan por la aduana pueden sufrir retrasos y los compradores son responsables de los aranceles o tarifas asociadas. Los vendedores pueden ponerse en contacto con usted en relaci�n con cargos adicionales para cubrir cualquier aumento en los costes de env�o de los art�culos.