BOOK OF I2C
HYDE,RANDALL
ISBN 10: 171850246X ISBN 13: 9781718502468
Editorial: No Starch Press, 2022
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Speedyhen LLC, Hialeah, FL, Estados Unidos de America
Calificación del vendedor: 2 de 5 estrellas
Vendedor de AbeBooks desde 23 de enero de 2026
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Descripción
Descripción:
N° de ref. del artículo NWUS9781718502468
Sinopsis:
An extensive practical guide to connecting real-world devices to microcontrollers with the popular I2C bus.
If you work with embedded systems, you’re bound to encounter the ubiquitous Inter-Integrated Circuit bus (IIC or I2C) – a serial protocol for connecting integrated circuits in a computer system. In The Book of I2C, the first comprehensive guide to this bus, bestselling author Randall Hyde draws on 40 years of industry experience to get you started designing and programming I2C systems.
Aided by over 100 detailed figures and annotated source-code listings, you’ll learn the I2C implementations of systems like Arduino, Teensy, and Raspberry Pi, as well as variants of the I2C and common I2C peripheral ICs complete with programming examples. For hardware hackers, electronics hobbyists, and software engineers of every skill level, the extensive coverage in this book will make it a go-to reference when it comes to connecting real-world devices to I2C microcontrollers.
Acerca del autor: Randall Hyde is the author of The Art of Assembly Language and Write Great Code, Volumes 1, 2, and 3 (all from No Starch Press), as well as Using 6502 Assembly Language and P-Source (Datamost). He is also the coauthor of Microsoft Macro Assembler 6.0 Bible (The Waite Group). Over the past 40 years, Hyde has worked as an embedded software/hardware engineer developing instrumentation for nuclear reactors, traffic control systems, and other consumer electronics devices. He has also taught computer science at California State Polytechnic University, Pomona, and at the University of California, Riverside. His website is http://www.randallhyde.com.
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Detalles bibliográficos
Título: BOOK OF I2C
Editorial: No Starch Press
Año de publicación: 2022
Encuadernación: Encuadernación de tapa blanda
Condición: NEW