Advanced Electronic Packaging (IEEE Press Series on Microelectronic Systems)
Ulrich, Richard K.; Brown, William D.
ISBN 10: 0471466093 ISBN 13: 9780471466093
Editorial: Wiley-IEEE Press (edition 2), 2006
Usado
Hardcover
Librería:
BooksRun, Philadelphia, PA, Estados Unidos de America
Calificación del vendedor: 5 de 5 estrellas
Vendedor de AbeBooks desde 2 de febrero de 2016
Este artículo en concreto ya no está disponible.
Descripción
Descripción:
It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting. N° de ref. del artículo 0471466093-8-1
Sinopsis:
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.
An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Acerca del autor: Richard K. Ulrich is a professor of chemical engineering at the University of Arkansas. He is a book editor and columnist on embedded passive technology, a NEMI committee member, an associate editor of IEEE Transactions on Advanced Packaging, and past chairman of chairman of the Dielectric Science and Technology Division of the Electrochemical Society.
WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.
"Sobre este título" puede pertenecer a otra edición de este libro.
Detalles bibliográficos
Título: Advanced Electronic Packaging (IEEE Press ...
Editorial: Wiley-IEEE Press (edition 2)
Año de publicación: 2006
Encuadernación: Hardcover
Condición: Very Good
Edición: 2.