Thanks to increasing power consumption and component density, localized "hot spots" are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.

Acerca del autor

Philip Y. Paik is a microfluids design engineer at Advanced Liquid Logic, Inc., in North Carolina. He received his Ph.D. in electrical engineering from Duke University. Vamsee K. Pamula is co-founder and vice president of Advanced Liquid Logic, Inc. in North Carolina. A member of IEEE, he earned his Ph.D. in electrical engineering at Duke University. Krishnendu Chakrabarty is associate professor in the Department of Electrical and Computer Engineering at Duke University, North Carolina. He is the author or coauthor of six books in the IC field, hehas contributed chapters to 13 additional works, and he has published over 200 technical papers. He received his Ph.D. in computer science and engineering from the University of Michigan.

"Sobre este t�tulo" puede pertenecer a otra edici�n de este libro.

Descripci�n de la librer�a

We specialise in General Interest Books from South Asian countries.

Ver la p�gina web de la librer�a

Informaci�n empresarial del vendedor

BOOKS AND PERIODICALS AGENCY LTD
90 Barnet Gate Lane, Barnet, EN5 2AX, United Kingdom

Condiciones de venta y env�o

Condiciones de venta

Returns accepted if you are not satisfied with the Service or Book.

Derecho a cancelaci�n

Condiciones de env�o

Best packaging and fast delivery

Tarifas de env�o de Reino Unido a Estados Unidos de America

Tarifas de env�o de Reino Unido a Estados Unidos de America
Cantidad del pedido	De 14 a 45 d�as h�biles	De 5 a 10 d�as h�biles
Primer art�culo	EUR 7.47	EUR 11.32

Los plazos de entrega los establecen los vendedores y var�an seg�n el transportista y la ubicaci�n. Los pedidos que pasan por la aduana pueden sufrir retrasos y los compradores son responsables de los aranceles o tarifas asociadas. Los vendedores pueden ponerse en contacto con usted en relaci�n con cargos adicionales para cubrir cualquier aumento en los costes de env�o de los art�culos.