A photonic chip that performs in simulation is only the beginning; the real test is whether its laser, layout, packaging and measured performance work together.
Does laser theory lead to sound device-design decisions?
Can a simulated PIC retain performance after fabrication and packaging?
Are material, coupling and thermal risks being assessed before tape-out?
Finlay Barker’s Diode Laser & Photonic Chip Engineering brings these challenges into one practical design manual. It connects semiconductor band structure, carrier injection, optical gain and threshold conditions with DFB, DBR and VCSEL architectures; then moves through PIC components, material-platform choices, III–V integration, simulation, foundry preparation and experimental characterisation. Worked calculations, design comparisons and end-to-end engineering workflows make the technical relationships visible.
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This is not a superficial introduction or a collection of disconnected equations. It is designed for engineers, researchers and graduate students who need technical depth linked to practical decisions. Its workflows explain transferable principles; access to commercial software, proprietary PDKs and foundry facilities remains dependent on the reader’s organisation and platform.
Scroll up and click the "Add to Cart" button now to strengthen your ability to design, simulate, integrate and troubleshoot high-performance photonic integrated circuits.
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Librería: California Books, Miami, FL, Estados Unidos de America
Condición: New. Print on Demand. Nº de ref. del artículo: I-9798140562403
Cantidad disponible: Más de 20 disponibles