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Advances In 3D Integrated Circuits And Systems: 1 (SERIES ON EMERGING TECHNOLOGIES IN CIRCUITS AND SYSTEMS) - Tapa blanda

Yu Hao

 
9789814699013: Advances In 3D Integrated Circuits And Systems: 1 (SERIES ON EMERGING TECHNOLOGIES IN CIRCUITS AND SYSTEMS)
Tapa blanda
ISBN 10: 9814699012 ISBN 13: 9789814699013
Editorial: Wspc, 2015

Sinopsis

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.

Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.

Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

"Sinopsis" puede pertenecer a otra edición de este libro.

Acerca del autor

Charlotte y Peter Fiell son dos autoridades en historia, teoría y crítica del diseño y han escrito más de sesenta libros sobre la materia, muchos de los cuales se han convertido en éxitos de ventas. También han impartido conferencias y cursos como profesores invitados, han comisariado exposiciones y asesorado a fabricantes, museos, salas de subastas y grandes coleccionistas privados de todo el mundo. Los Fiell han escrito numerosos libros para TASCHEN, entre los que se incluyen 1000 Chairs, Diseño del siglo XX, El diseño industrial de la A a la Z, Scandinavian Design y Diseño del siglo XXI.

De la contraportada

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory. Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Wspc
Año de publicación
2015
Idioma
Inglés
ISBN 10 
9814699012
ISBN 13 
9789814699013
Encuadernación
Tapa blanda
Número de edición
1
Número de páginas
392
Contacto del fabricante
no disponible
Persona responsable
gpsr@libri.de
gpsr@libri.de

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