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3D Integration for VLSI Systems - Tapa dura

 
9789814303811: 3D Integration for VLSI Systems
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ISBN 10: 981430381X ISBN 13: 9789814303811
Editorial: Jenny Stanford Publishing, 2011

Sinopsis

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.

There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.

"Sinopsis" puede pertenecer a otra edición de este libro.

Acerca del autor

Chuan Seng Tan, Kuan-Neng Chen

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Jenny Stanford Publishing
Año de publicación
2011
Idioma
Inglés
ISBN 10 
981430381X
ISBN 13 
9789814303811
Encuadernación
Tapa dura
Número de edición
1
Número de páginas
378
Editor
Tan Chuan Seng, Chen Kuan-Neng, Koester Steven J.
Contacto del fabricante
Taylor and Francis, GPSR Taylor and Francis
gpsr@taylorandfrancis.com

Taylor & Francis Verlag GmbH, Kaufingerstraße 24
München
80331
Alemania