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High Performance Design Automation For Multi-chip Modules And Packages: 5 (Selected Topics in Electronics and Systems) - Tapa dura
Sinopsis
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
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Reseña del editor
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
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High Performance Design Automation for Multi-Chip Modules and Packages
Publicado por
World Scientific Publishing Company, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
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Librería: La bataille des livres, Pradinas, Francia
Calificación del vendedor: 5 de 5 estrellas
Condición: Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |. Nº de ref. del artículo: 00-QHTT-IRAJ
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HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Selected Topics in Electronics and Systems)
Publicado por
World Scientific Publishing Company, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
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Librería: Russell Books, Victoria, BC, Canada
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hardcover. Condición: New. Special order direct from the distributor. Nº de ref. del artículo: ING9789810223076
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HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Hardcover)
Publicado por
World Scientific Publishing Co Pte Ltd, Singapore, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
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Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de America
Calificación del vendedor: 5 de 5 estrellas
Hardcover. Condición: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Nº de ref. del artículo: 9789810223076
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High Performance Design Automation for Multi-Chip Modules and Packages
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WORLD SCIENTIFIC PUB CO INC, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
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Librería: moluna, Greven, Alemania
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Condición: New. KlappentextrnrnThe aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partiti. Nº de ref. del artículo: 909655129
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High Performance Design Automation for Multi-Chip Modules and Packages (Current Topics in Electronics and Systems, Vol 5)
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World Scientific Pub Co Inc, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
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Librería: Revaluation Books, Exeter, Reino Unido
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Hardcover. Condición: Brand New. 254 pages. 10.25x7.00x0.75 inches. In Stock. Nº de ref. del artículo: x-9810223072
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High Performance Design Automation for Multi-Chip Modules and Packages (Current Topics in Electronics and Systems, Vol 5)
Publicado por
World Scientific Pub Co Inc, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
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Librería: Mispah books, Redhill, SURRE, Reino Unido
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Hardcover. Condición: Like New. Like NewLIKE NEW. book. Nº de ref. del artículo: ERICA85498102230723
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HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Hardcover)
Publicado por
World Scientific Publishing Co Pte Ltd, Singapore, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
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Librería: AussieBookSeller, Truganina, VIC, Australia
Calificación del vendedor: 5 de 5 estrellas
Hardcover. Condición: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. Nº de ref. del artículo: 9789810223076
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High Performance Design Automation For Multi-Chip Modules and Packages (Volume 5)
Publicado por
World Scientific Publishing, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
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Librería: Kennys Bookstore, Olney, MD, Estados Unidos de America
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Condición: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . Books ship from the US and Ireland. Nº de ref. del artículo: V9789810223076
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High Performance Design Automation For Multi-Chip Modules and Packages (Volume 5)
Publicado por
World Scientific Publishing, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
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Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
Calificación del vendedor: 5 de 5 estrellas
Condición: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . Nº de ref. del artículo: V9789810223076
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