Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly - Tapa blanda

Hwang, Jennie S.

9789401160513: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

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ISBN 10: 9401160511 ISBN 13: 9789401160513

Editorial: Springer, 2012

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Detalles de la edici�n

Editorial: Springer
A�o de publicaci�n: 2012
Idioma: Ingl�s
ISBN 10: 9401160511
ISBN 13: 9789401160513
Encuadernaci�n: Paperback
Contacto del fabricante: no disponible
Persona responsable: no disponible

Otras ediciones populares con el mismo t�tulo

9780442207540: Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits and Component Assembly

Edici�n Destacada

ISBN 10: 0442207549 ISBN 13: 9780442207540
Editorial: Kluwer Academic Publishers, 1989
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