Language:Chinese.No Binding.publisher:Harbin Engineering University Press Pub. Date :200.description:Pages Number: 240 Publisher: Harbin Engineering University Press Pub. Date :2009-08. This book is composed of three parts: First. the identification chip components and desoldering; Second. various types of SMD diodes. and diode combination
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Librería: liu xing, Nanjing, JS, China
paperback. Condición: New. Language:Chinese.Pages Number: 240 Publisher: Harbin Engineering University Press Pub. Date :2009-08. This book is composed of three parts: First. the identification chip components and desoldering; Second. various types of SMD diodes. and diode combination. Nº de ref. del artículo: J50194
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