电子封装技术实验 - Tapa blanda

Electronic packaging technology experiment(Chinese Edition)

paperback. Condición: New. Paperback. Pub Date: 2019-12-01 Pages: 166 Language: Chinese Publisher: Metallurgical Industry Press Electronic Packaging Technology Experiment is written to meet the needs of experimental textbooks for undergraduate teaching of electronic packaging technology in the new era. and aims to promote Students have a deep understanding of professional theoretical knowledge. cultivate students' practical ability and experimental skills. improve students' experimental design thinking and stimulate st. Nº de ref. del artículo: NS056624

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