Language:Chinese.Soft cover.publisher:Tsinghua University Press.description:Paperback . Publisher: Tsinghua University Press. This book focuses on the system using Moldflow products
"Sinopsis" puede pertenecer a otra edición de este libro.
EUR 15,44 gastos de envío desde China a Estados Unidos de America
Destinos, gastos y plazos de envíoLibrería: liu xing, Nanjing, JS, China
paperback. Condición: New. Paperback. Pub Date: Jun Pages: 279 in Publisher: Tsinghua University Press book focus describes the basic process and method Moldflow (MPI) system the molding product analysis and design optimization. For the most common problems in the actual design and production process. select the five actual application case. each case is different emphases. respectively. including the basic analysis process. gate location. design. the flow balanced design. weld line elimination and process aspects of t. Nº de ref. del artículo: CC000897
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