【众星图书精品】三维集成电路制造技术 - Tapa dura

Three-dimensional integrated circuit manufacturing technology(Chinese Edition)

Hardcover. Condición: New. HardCover. Pub Date: 2022-08-01 Pages: 376 Language: Chinese Publisher: Electronic Industry Press At present. the feature size of integrated circuit devices is getting closer and closer to the physical limit. and integrated circuit technology has moved towards three-dimensional integration. improving performance/power consumption Compared with the development of new technology routes. Based on the development trend and technical route of global integrated circuit technology. combined with the. Nº de ref. del artículo: NY043158

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