集成电路芯片封装技术（第２版） - Tapa blanda

IC chip packaging technology ( 2nd Edition ) application personnel training colleges planning materials(Chinese Edition)

paperback. Condición: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2013-07-01 Pages: 252 Language: Chinese Publisher: Electronic Industry Press IC chip packaging technology ( 2nd Edition ) Applied Talents universities planning materials is a general-purpose integrated circuits chip packaging technology materials. The book has 13 chapters. including integrated circuit chip package overview. packaging process. thick film technology . welding materials. printed circuit boards. components and circuit board bonding . sealing plastic materials.Four Satisfaction guaranteed,or money back. Nº de ref. del artículo: BR077070

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