三维集成电路设计【正版书】 - Tapa blanda

International Mechanical Engineering Advanced Technology Renditions : 3D IC design(Chinese Edition)

paperback. Condición: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Pub Date :2013-09-01 Pages: 224 Publisher: Machinery Industry Press at the end of the first decade of the 21st century . based on 3D integration technology. More than Moore era quietly arrived. Have multiple active devices planes 3D IC (3DIC). is expected to provide a compact. flexible cabling . transmission speed and the number of multi- channel interconnect structures . thus providing breakthrough interconnect bottleneck for the effective IC designers means . but also to the effective integ.Four Satisfaction guaranteed,or money back. Nº de ref. del artículo: RW055186

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