【按需印刷】-集成电路三维系统集成与封装工艺（中文导读） - Tapa blanda

Information Science and Technology academic Works series: integrated circuit three-dimensional system integration and packaging Technology (Chinese guide)(Chinese Edition)

paperback. Condición: New. Paperback. Pub Date: 2017-03-01 Pages: $number Language: Chinese Publisher: Science Press. Journal of Information Science and technology: integrated circuit three-dimensional system integration and encapsulation Technology (Chinese Guide) system discussion for electronic. 2 of optoelectronic and MEMS devices. 5D. 3D. and 3D IC integration and packaging technology . Nº de ref. del artículo: DP052518

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