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Sinopsis
Copper has one third the resistivity of Aluminum and can be electrodeposited easily. Hence, Copper can be used for chip wiring. This Nanofablicaton technology is used to electrodeposit Copper into the fine cavities or vias of diameters less than 0.1μm, and lengths 1/1000 of the diameter of human hair. Since then the Copper Damascene on chip semiconductor wiring process has spread out to semiconductor industries all over the world and branched into four major industrial applications: Damascene, through silicon via, interstitial via hole build-up printed wiring boards and Copper foil that is smooth on both sides. However, no comprehensive books have been published in this area of acceleration in Copper bottom up filling. The present book starts from a fundamental review of Copper electrodeposition. The book covers five topics on the key to acceleration in Copper bottom up filling. Role of additives in Copper bottom up filling. Review on acceleration effect, basic items to understand the cuprous acceleration effect, mechanism of cuprous acceleration and application of cuprous acceleration applied to Through Silicon Via(TSV). We really hope that this book will give some help.
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Reseña del editor
Copper has one third the resistivity of Aluminum and can be electrodeposited easily. Hence, Copper can be used for chip wiring. This Nanofablicaton technology is used to electrodeposit Copper into the fine cavities or vias of diameters less than 0.1μm, and lengths 1/1000 of the diameter of human hair. Since then the Copper Damascene on chip semiconductor wiring process has spread out to semiconductor industries all over the world and branched into four major industrial applications: Damascene, through silicon via, interstitial via hole build-up printed wiring boards and Copper foil that is smooth on both sides. However, no comprehensive books have been published in this area of acceleration in Copper bottom up filling. The present book starts from a fundamental review of Copper electrodeposition. The book covers five topics on the key to acceleration in Copper bottom up filling. Role of additives in Copper bottom up filling. Review on acceleration effect, basic items to understand the cuprous acceleration effect, mechanism of cuprous acceleration and application of cuprous acceleration applied to Through Silicon Via(TSV). We really hope that this book will give some help.
Biografía del autor
Kazuo Kondo is Professor and Director of Small Feature Electrodeposition Center, Osaka Prefecture University. He has worked for Sumitomo Metal Industries, Hokkaido University and Okayama University. He has 200 research publications and 100 patents. His research is Copper Electrodeposition for wiring of semiconductor and electronics packaging.
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Cuprous is key to acceleration in Copper bottom up filling
Publicado por
LAP Lambert Academic Publishing Aug 2017, 2017
ISBN 10: 620200634X
ISBN 13: 9786202006347
Nuevo
Taschenbuch
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
Calificación del vendedor: 5 de 5 estrellas
Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Copper has one third the resistivity of Aluminum and can be electrodeposited easily. Hence, Copper can be used for chip wiring. This Nanofablicaton technology is used to electrodeposit Copper into the fine cavities or vias of diameters less than 0.1mim, and lengths 1/1000 of the diameter of human hair. Since then the Copper Damascene on chip semiconductor wiring process has spread out to semiconductor industries all over the world and branched into four major industrial applications: Damascene, through silicon via, interstitial via hole build-up printed wiring boards and Copper foil that is smooth on both sides. However, no comprehensive books have been published in this area of acceleration in Copper bottom up filling. The present book starts from a fundamental review of Copper electrodeposition. The book covers five topics on the key to acceleration in Copper bottom up filling. Role of additives in Copper bottom up filling. Review on acceleration effect, basic items to understand the cuprous acceleration effect, mechanism of cuprous acceleration and application of cuprous acceleration applied to Through Silicon Via(TSV). We really hope that this book will give some help. 84 pp. Englisch. Nº de ref. del artículo: 9786202006347
Cantidad disponible: 2 disponibles
Imagen del vendedor
Cuprous is key to acceleration in Copper bottom up filling
Publicado por
LAP Lambert Academic Publishing, 2017
ISBN 10: 620200634X
ISBN 13: 9786202006347
Nuevo
Taschenbuch
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Calificación del vendedor: 5 de 5 estrellas
Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Copper has one third the resistivity of Aluminum and can be electrodeposited easily. Hence, Copper can be used for chip wiring. This Nanofablicaton technology is used to electrodeposit Copper into the fine cavities or vias of diameters less than 0.1mim, and lengths 1/1000 of the diameter of human hair. Since then the Copper Damascene on chip semiconductor wiring process has spread out to semiconductor industries all over the world and branched into four major industrial applications: Damascene, through silicon via, interstitial via hole build-up printed wiring boards and Copper foil that is smooth on both sides. However, no comprehensive books have been published in this area of acceleration in Copper bottom up filling. The present book starts from a fundamental review of Copper electrodeposition. The book covers five topics on the key to acceleration in Copper bottom up filling. Role of additives in Copper bottom up filling. Review on acceleration effect, basic items to understand the cuprous acceleration effect, mechanism of cuprous acceleration and application of cuprous acceleration applied to Through Silicon Via(TSV). We really hope that this book will give some help. Nº de ref. del artículo: 9786202006347
Cantidad disponible: 1 disponibles
Imagen del vendedor
Cuprous is key to acceleration in Copper bottom up filling
Publicado por
LAP LAMBERT Academic Publishing, 2017
ISBN 10: 620200634X
ISBN 13: 9786202006347
Nuevo
Kartoniert / Broschiert
Librería: moluna, Greven, Alemania
Calificación del vendedor: 4 de 5 estrellas
Kartoniert / Broschiert. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Kondo KazuoKazuo Kondo is Professor and Director of Small Feature Electrodeposition Center, Osaka Prefecture University. He has worked for Sumitomo Metal Industries, Hokkaido University and Okayama University. He has 200 research pub. Nº de ref. del artículo: 160187846
Cantidad disponible: Más de 20 disponibles
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Cuprous is key to acceleration in Copper bottom up filling
Publicado por
LAP LAMBERT Academic Publishing, 2017
ISBN 10: 620200634X
ISBN 13: 9786202006347
Nuevo
Paperback
Librería: Revaluation Books, Exeter, Reino Unido
Calificación del vendedor: 5 de 5 estrellas
Paperback. Condición: Brand New. 84 pages. 8.66x5.91x0.19 inches. In Stock. Nº de ref. del artículo: zk620200634X
Cantidad disponible: 1 disponibles
Imagen del vendedor
Cuprous is key to acceleration in Copper bottom up filling
Publicado por
LAP Lambert Academic Publishing Aug 2017, 2017
ISBN 10: 620200634X
ISBN 13: 9786202006347
Nuevo
Taschenbuch
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
Calificación del vendedor: 5 de 5 estrellas
Taschenbuch. Condición: Neu. Neuware -Copper has one third the resistivity of Aluminum and can be electrodeposited easily. Hence, Copper can be used for chip wiring. This Nanofablicaton technology is used to electrodeposit Copper into the fine cavities or vias of diameters less than 0.1¿m, and lengths 1/1000 of the diameter of human hair. Since then the Copper Damascene on chip semiconductor wiring process has spread out to semiconductor industries all over the world and branched into four major industrial applications: Damascene, through silicon via, interstitial via hole build-up printed wiring boards and Copper foil that is smooth on both sides. However, no comprehensive books have been published in this area of acceleration in Copper bottom up filling. The present book starts from a fundamental review of Copper electrodeposition. The book covers five topics on the key to acceleration in Copper bottom up filling. Role of additives in Copper bottom up filling. Review on acceleration effect, basic items to understand the cuprous acceleration effect, mechanism of cuprous acceleration and application of cuprous acceleration applied to Through Silicon Via(TSV). We really hope that this book will give some help.Books on Demand GmbH, Überseering 33, 22297 Hamburg 84 pp. Englisch. Nº de ref. del artículo: 9786202006347
Cantidad disponible: 2 disponibles