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Advances of Lead-Free Solder: Processing & Characterization - Tapa blanda

Mohd Salleh, Mohd Arif Anuar; Abdullah, Mohd Mustafa Al Bakri; Saud, Norainiza

 
9783848408825: Advances of Lead-Free Solder: Processing & Characterization
Tapa blanda
ISBN 10: 3848408821 ISBN 13: 9783848408825
Editorial: LAP LAMBERT Academic Publishing, 2012

Sinopsis

Processing & Characterization provides information on most implemented lead-free solder processing, reaction mechanism and characterization techniques involved. This book also includes a newly invented composite lead-free solder processing and characterization techniques. The resulted presented in this book were part of the experimental works at Universiti Malaysia Perlis (UniMAP) and National University of Malaysia (UKM). The chapters are organized around the following subject areas: solder developments, fundamental issues, mechanical and electrical properties, the factors affecting the reliability of lead-free solders and the processing techniques of new lead-free solder composite. It is not intended to be an exhaustive review of the literature but to be a practical reference guide for selected, key subject areas. The topics are in sufficient detail to be informative and a good practical guide to address issues of concern in lead-free solder areas. It is hope that this book provides wider awareness of the current status of lead-free electronic solders.

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Reseña del editor

Processing & Characterization provides information on most implemented lead-free solder processing, reaction mechanism and characterization techniques involved. This book also includes a newly invented composite lead-free solder processing and characterization techniques. The resulted presented in this book were part of the experimental works at Universiti Malaysia Perlis (UniMAP) and National University of Malaysia (UKM). The chapters are organized around the following subject areas: solder developments, fundamental issues, mechanical and electrical properties, the factors affecting the reliability of lead-free solders and the processing techniques of new lead-free solder composite. It is not intended to be an exhaustive review of the literature but to be a practical reference guide for selected, key subject areas. The topics are in sufficient detail to be informative and a good practical guide to address issues of concern in lead-free solder areas. It is hope that this book provides wider awareness of the current status of lead-free electronic solders.

Biografía del autor

Mohd Arif Anuar Mohd Salleh is a lecturer and currently holds the Materials Engineering Programme Chairman post at Universiti Malaysia Perlis (UniMAP). He has vast experience working and lecturing in electronic packaging field. His achievements includes numbers of publication through proceedings, journals and books.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
LAP LAMBERT Academic Publishing
Año de publicación
2012
Idioma
Inglés
ISBN 10 
3848408821
ISBN 13 
9783848408825
Encuadernación
Tapa blanda
Número de páginas
84
Contacto del fabricante
no disponible
Persona responsable
no disponible