Sub-micron Resolution 3D Structure Writing Using TPA Process - Tapa blanda

Rahim Chowdhury, Zahidur

 
9783836483711: Sub-micron Resolution 3D Structure Writing Using TPA Process
Tapa blanda
ISBN 10: 3836483718 ISBN 13: 9783836483711
Editorial: VDM Verlag Dr. Müller, 2008

Sinopsis

The two photon absorption (TPA) process is currently used to write high resolution microstructures that can be used in micro-electro-mechanical system (MEMS) and photonic crystal application. Key parameters required to predict the final structure formation for this process are experimentally determined and reported in this thesis for two commercially available resists, Ormocore and SU-8. Moreover, writing capability of 3D structures with simple features is demonstrated in this work.The TPA coefficients of resists were measured for 800 nm (wavelength) light. Light source with such wavelength, Ti:Sapphire femto-second laser, is mostly used for such application. The etch rate, another important parameter of a resist, is determined by varying the exposure dose and measuring the final thickness of the resist layer after different developing time.Mechanical stages with relatively high precision were used to scan the focused laser beam inside the resist in order to produce 3D structures. Rows and dots with different heights, square spirals and hanging beams were fabricated with different thickness by controlling the beam power and the scanning speed.

"Sinopsis" puede pertenecer a otra edición de este libro.

Reseña del editor

The two photon absorption (TPA) process is currently used to write high resolution microstructures that can be used in micro-electro-mechanical system (MEMS) and photonic crystal application. Key parameters required to predict the final structure formation for this process are experimentally determined and reported in this thesis for two commercially available resists, Ormocore and SU-8. Moreover, writing capability of 3D structures with simple features is demon­strated in this work. The TPA coefficients of resists were measured for 800 nm (wavelength) light. Light source with such wavelength, Ti:Sapphire femto-second laser, is mostly used for such application. The etch rate, another important parameter of a resist, is determined by varying the exposure dose and measuring the final thickness of the resist layer after different developing time. Mechanical stages with relatively high precision were used to scan the focused laser beam inside the resist in order to produce 3D structures. Rows and dots with different heights, square spirals and hanging beams were fabri­cated with different thickness by controlling the beam power and the scanning speed.

Biografía del autor

Zahidur Rahim Chowdhury has completed his BSc degree in Electrical and Electronic Engineering from Bangladesh University of Engineering and Technology (BUET), Bangladesh, and MSC in Electrical and Computer Engineering from University of Alberta, Canada. Currently he is working at United International University, Bangladesh, as a faculty.

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Editorial
VDM Verlag Dr. Müller
Año de publicación
2008
Idioma
Inglés
ISBN 10 
3836483718
ISBN 13 
9783836483711
Encuadernación
Tapa blanda
Número de páginas
140
Contacto del fabricante
no disponible
Persona responsable
no disponible