Artículos relacionados a The International Conference on Electronics, Engineering...

The International Conference on Electronics, Engineering Physics and Earth Science (EEPES 2024) - Tapa dura

 
9783725824137: The International Conference on Electronics, Engineering Physics and Earth Science (EEPES 2024)
Tapa dura
ISBN 10: 3725824134 ISBN 13: 9783725824137
Editorial: MDPI AG, 2024

Sinopsis

The third edition of the International Conference on Electronics, Engineering Physics and Earth Science (EEPES 2024) was held on a hybrid basis in Kavala, Greece, from 19 to 21 June, 2024. The EEPES Conference is the premier international gathering, organized by the Association CIEES and financial support by EEPES Ltd., both from Bulgaria, which focus on understanding the current state and evolution of the science through the lens of engineering physics, electronic devices and microelectronics, telecommunications, optical and electromagnetic communication, artificial intelligence and soft computing, environmental physics and renewable energy, and many other disciplines. It is a place where researchers, academics, industry representatives, students, and others can present and discuss their progress in research, development, standards, and applications related to applied and engineering physics. The technical program of the conference consists of one plenary session, one technical session, and six in-person and eight online tracks for research papers. The authors of the accepted papers, who were unable to attend the conference in person, were given the option to present their papers online and attend an interactive virtual conference.

"Sinopsis" puede pertenecer a otra edición de este libro.

Editorial
MDPI AG
Año de publicación
2024
Idioma
Inglés
ISBN 10 
3725824134
ISBN 13 
9783725824137
Encuadernación
Tapa dura
Número de páginas
592
Editor
Mihaylov Grigor, Stoyanov Ivaylo, Iliev Teodor
Contacto del fabricante
no disponible
Persona responsable
GPSR Kontakt
gpsr@libri.de

Europaallee 1
Bad Hersfeld
36244
Alemania