Ultracompact Polymer Waveguide Devices for WDM Application - Tapa blanda

Lin, Yongbin

 
9783639007404: Ultracompact Polymer Waveguide Devices for WDM Application
Tapa blanda
ISBN 10: 3639007409 ISBN 13: 9783639007404
Editorial: VDM Verlag Dr. Mueller e.K., 2008

Sinopsis

A fabrication process for PFCB waveguide air-trench bends on silicon substrate with electron beam lithography (EBL) and autoalignment has been developed and a high efficiency air-trench bend (97.2% for TE polarization and 96.2% for TM polarization) has been demonstrated. The simulation predicts an optical efficiency of 98.5% for TE and 98.2% for TM when the Goos Hanchen shift is properly accounted for. We have adapted this process to making air trench bends in PFCB waveguides on polyimide substrates. Compared to silicon substrates, the polyimide substrates have the advantage of less coefficient of thermal expansion (CTE) mismatch with PFCB films, which improves fabrication repeatability and yield. Using air-trench bends, an ultracompact 8 x 8 arrayed waveguide grating (AWG) demultiplexer (200 GHz) for WDM has been designed and fabricated on a polyimide substrate. Compared to a conventional AWG in the same material system, the air-trench bend AWG shrinks the required chip area by a factor of 20. The decreased size is a factor in reducing the measured thermal shift to -0.012 nm/C and decreasing the polarization-dependent wavelength shift to 1.3 nm.

"Sinopsis" puede pertenecer a otra edición de este libro.

Reseña del editor

A fabrication process for PFCB waveguide air-trench bends on silicon substrate with electron beam lithography (EBL) and autoalignment has been developed and a high efficiency air-trench bend (97.2% for TE polarization and 96.2% for TM polarization) has been demonstrated. The simulation predicts an optical efficiency of 98.5% for TE and 98.2% for TM when the Goos Hanchen shift is properly accounted for. We have adapted this process to making air trench bends in PFCB waveguides on polyimide substrates. Compared to silicon substrates, the polyimide substrates have the advantage of less coefficient of thermal expansion (CTE) mismatch with PFCB films, which improves fabrication repeatability and yield. Using air-trench bends, an ultracompact 8 x 8 arrayed waveguide grating (AWG) demultiplexer (200 GHz) for WDM has been designed and fabricated on a polyimide substrate. Compared to a conventional AWG in the same material system, the air-trench bend AWG shrinks the required chip area by a factor of 20. The decreased size is a factor in reducing the measured thermal shift to -0.012 nm/C and decreasing the polarization-dependent wavelength shift to 1.3 nm.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
VDM Verlag Dr. Mueller e.K.
Año de publicación
2008
Idioma
Inglés
ISBN 10 
3639007409
ISBN 13 
9783639007404
Encuadernación
Tapa blanda
Número de páginas
108
Contacto del fabricante
no disponible
Persona responsable
no disponible