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Mechatronics by Bond Graphs: An Object-oriented Approach to Modelling and Simulation (Engineering Online Library) - Tapa dura

Damic, Vjekoslav; Montgomery, John

 
9783540423751: Mechatronics by Bond Graphs: An Object-oriented Approach to Modelling and Simulation (Engineering Online Library)

Sinopsis

Bondgraphs are a well-established technique for the modelling of complex engineering systems. The subject of this book is an integrated modelling and simulation of mechatronics systems in a visual computer environment. The modelling is based on system top-down and bottom-up approach. The mathematical models are generated in a form of differential-algebraic equations and solved using numerical and symbolic algebra methods. The authors carefully explain a systematic procedure for developing the models using simple visual commands and construct a bondgraph at every level of decomposition. The integrated approach they develop is applied to mechanical, electrical and control systems, multibody dynamics, and continuous systems. The book contains a powerful computer simulation package on the accompanying CD-ROM. The BondSim package supports top-down and bottom-up model development using component libraries.

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Reseña del editor

Bondgraphs are a well-established technique for the modelling of complex engineering systems. The subject of this book is an integrated modelling and simulation of mechatronics systems in a visual computer environment. The modelling is based on system top-down and bottom-up approach. The mathematical models are generated in a form of differential-algebraic equations and solved using numerical and symbolic algebra methods. The authors carefully explain a systematic procedure for developing the models using simple visual commands and construct a bondgraph at every level of decomposition. The integrated approach they develop is applied to mechanical, electrical and control systems, multibody dynamics, and continuous systems. The book contains a powerful computer simulation package on the accompanying CD-ROM. The BondSim package supports top-down and bottom-up model development using component libraries.

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