Integration of 2D Materials for Electronics Applications - Tapa blanda

 
9783038976066: Integration of 2D Materials for Electronics Applications
Tapa blanda
ISBN 10: 3038976067 ISBN 13: 9783038976066
Editorial: MDPI AG, 2019

Sinopsis

Two-dimensional (2D) materials and their vertical/lateral heterostructures are currently the subject of massive research interests, both for fundamental science and for technological applications in diverse fields, such as electronics, optoelectronics, quantum metrology, spintronics, membranes, energy conversion/storage, and sensing. Integration of 2D materials within real device structures currently represents the main challenge to move from the laboratory stage to industrial applications, especially in the fields of electronics/optoelectronics.

This Book is a collection of 9 papers, covering the different key topics of this rapidly developing research field. These include: synthesis of 2D materials, progress in relevant processing issues (contact, doping and mobility engineering), advanced characterization techniques, novel device applications based on the integration of these 2D materials.

 

Many of the papers of this collection are review papers, providing the general introductory information and a broad overview of the most recent advances in the specific topic. Hence, this book can serve both as a general introduction for non-experts in the field and as a guide for scientists/engineers working in the field of 2D materials integration.

"Sinopsis" puede pertenecer a otra edición de este libro.

Editorial
MDPI AG
Año de publicación
2019
Idioma
Inglés
ISBN 10 
3038976067
ISBN 13 
9783038976066
Encuadernación
Tapa blanda
Número de páginas
264
Editor
Giannazzo Filippo, Eriksson Jens, Avila Samuel Lara
Contacto del fabricante
no disponible
Persona responsable
Buchpark GmbH
gpsr@buchpark.de

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Alemania