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9783031437809: 6th International Conference on Signal Processing and Information Communications: ICSPIC 2023 (Signals and Communication Technology)

Sinopsis

This book presents the proceedings of the 6th International Conference on Signal Processing and Information Communications (ICSPIC 2023), which was held in Singapore, on February 25-27, 2023. The conference aims to provide a leading international forum for researchers, practitioners, and professionals from the industry, academia and government to share their new ideas, progresses and achievements in signal processing and information communications. The contributions focus on the latest advances, trends and future challenges in analog and mixed signal processing, design and implementation of signal processing systems, compressive sensing, machine learning methods for communications and signal processing, multimedia signal processing, natural language processing, next generation mobile communications, nonlinear signal processing, optical communications, parallel and distributed processing, and more.

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Acerca del autor

Dr. Chua-Chin Wang received the Ph.D. degree in electrical engineering from SUNY (State University of New York) at Stony Brook, USA, in 1992. He then joined Department of Electrical Engineering, National Sun Yat-Sen University (NSYSU), Taiwan. He was Chairman of this department during 2009 - 2012. He was CEO of Operation Center of Industry-University Cooperation, NSYSU, in 2012-2014. He was appointed to be VP of Office of Industrial Collaboration and Continuing Education Affairs, from 2014 to 2015. He was elected as Dean of Engineering College during 2014-2017. He became as Director Generalof Underwater Vehicle R&D Center since 2018. He is now Vice President, Office of Research and Development, NSYSU. Dr. Wang’s research interests include memory and logic circuit design, communication circuit design, bio-medical circuits, and particularly interfacing I/O circuits. He also won Distinguished Electrical Engineering Professor Award of Chinese Institute of Electrical Engineers in 2007. In 2010, he was honored to be Distinguished Professor of National Sun Yat-Sen University. In 2012, he won “Distinguished Engineering Professor” Award of Chinese Institute of Engineers and Outstanding Research Award of NSYSU. He became IET Fellow in 2012. He was named as ASE Chair Professor in 2013 for the recognition of his achievement in the area of VLSI design and contribution to industry technology development. He won Outstanding Technical Achievement Award of IEEE Tainan Section in 2018. Prof. Wang has devoted himself for many IEEE services. He was Tainan Chapter Chair of IEEE Circuits and Systems Society (CASS) in 2007-2008. He was also the founding Tainan Chair of IEEE Solid-State Circuits Society (SSCS) for 2007-2008, and the founding Consultant of IEEE NSYSU Student Branch. He was elected to be Vice Chair of IEEE Tainan Section in 2012. He was elected to be Chair of IEEE CASS Nanoelectronics and Giga-scale Systems (NG) Technical Committee to serve during 2008-2009. He has been invited to be Associate Editors of IEEE Trans. on TCAS-I (2010-2013) and TCAS-II (2010-2011). He was General Chair of 2012 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), which is the flagship conference of IEEE CASS Region 10.

 

Dr. Arumugam Nallanathan is Professor of Wireless Communications and the founding head of the Communication Systems Research (CSR) group in the School of Electronic Engineering and Computer Science at Queen Mary University of London since September 2017. He was with the Department of Informatics at King’s College London from December 2007 to August 2017, where he was Professor of Wireless Communications from April 2013 to August 2017. He was an Assistant Professor in the Department of Electrical and Computer Engineering, National University of Singapore from August 2000 to December 2007. His research interests include 6G Wireless Networks, Internet of Things (IoT) and Molecular Communications. He published more than 500 technical papers in scientific journals and international conferences. He is a co-recipient of the Best Paper Awards presented at the IEEE International Conference on Communications 2016 (ICC’2016), IEEE Global Communications Conference 2017 (GLOBECOM’2017) and IEEE Vehicular Technology Conference 2017 (VTC’2017). He is an Editor-at-Large for IEEE Transactions on Communications and a senior editor for IEEE Wireless Communications Letters. He was an Editor for IEEE Transactions on Wireless Communications (2006-2011), IEEE Transactions on Vehicular Technology (2006-2017), IEEE Signal Processing Letters and a Guest Editor for IEEE Journal on Selected Areas in Communications (JSAC). He served as the Chair for the Signal Processing and Computing for Communications (SPCC-TC) of IEEE Communications Society and Technical Program Chair and member of Technical Program Committees in numerous IEEE conferences. He received the IEEE Communications Society SPCE outstanding service award 2012 and IEEE Communications Society RCC outstanding service award 2014. He has been selected as a Web of Science (ISI) Highly Cited Researcher in 2016. He is an IEEE Fellow and IEEE Distinguished Lecturer.


De la contraportada

This book presents the proceedings of the 6th International Conference on Signal Processing and Information Communications (ICSPIC 2023), which was held in Singapore, on February 25-27, 2023. The conference aims to provide a leading international forum for researchers, practitioners, and professionals from the industry, academia and government to share their new ideas, progresses and achievements in signal processing and information communications. The contributions focus on the latest advances, trends and future challenges in Analog and Mixed Signal Processing, Design and Implementation of Signal Processing Systems, compressive sensing, machine learning methods for communications and signal processing, Multimedia Signal Processing, Natural Language Processing, Next Generation Mobile Communications, Nonlinear Signal Processing, Optical Communications, Parallel and Distributed Processing, and more.

  • Presents the proceedings of the 6th International Conference on Signal Processing and Information Communications
  • Includes papers on digital signal and image processing, modern information technology and management
  • Provides the diverse perspectives from academics and practitioners from around the world.

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9783031437830: 6th International Conference on Signal Processing and Information Communications: ICSPIC 2023 (Signals and Communication Technology)

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ISBN 10:  3031437837 ISBN 13:  9783031437830
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Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Dr. Chua-Chin Wang received the Ph.D. degree in electrical engineering from SUNY (State University of New York) at Stony Brook, USA, in 1992. He then joined Department of Electrical Engineering, National Sun Yat-Sen University (NSYSU), Taiwan. He was Cha. Nº de ref. del artículo: 1027290475

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Wang, Chua-chin (EDT); Nallanathan, Arumugam (EDT)
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Hardcover. Condición: new. Hardcover. This book presents the proceedings of the 6th International Conference on Signal Processing and Information Communications (ICSPIC 2023), which was held in Singapore, on February 25-27, 2023. The conference aims to provide a leading international forum for researchers, practitioners, and professionals from the industry, academia and government to share their new ideas, progresses and achievements in signal processing and information communications. The contributions focus on the latest advances, trends and future challenges in analog and mixed signal processing, design and implementation of signal processing systems, compressive sensing, machine learning methods for communications and signal processing, multimedia signal processing, natural language processing, next generation mobile communications, nonlinear signal processing, optical communications, parallel and distributed processing, and more. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Nº de ref. del artículo: 9783031437809

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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the proceedings of the 6th International Conference on Signal Processing and Information Communications (ICSPIC 2023), which was held in Singapore, on February 25-27, 2023. The conference aims to provide a leading international forum for researchers, practitioners, and professionals from the industry, academia and government to share their new ideas, progresses and achievements in signal processing and information communications.The contributions focus on the latest advances, trends and future challenges in analog and mixed signal processing, design and implementation of signal processing systems, compressive sensing, machine learning methods for communications and signal processing, multimedia signal processing, natural language processing, next generation mobile communications, nonlinear signal processing, optical communications, parallel and distributed processing, and more. 128 pp. Englisch. Nº de ref. del artículo: 9783031437809

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Buch. Condición: Neu. Neuware -This book presents the proceedings of the 6th International Conference on Signal Processing and Information Communications (ICSPIC 2023), which was held in Singapore, on February 25-27, 2023. The conference aims to provide a leading international forum for researchers, practitioners, and professionals from the industry, academia and government to share their new ideas, progresses and achievements in signal processing and information communications. The contributions focus on the latest advances, trends and future challenges in analog and mixed signal processing, design and implementation of signal processing systems, compressive sensing, machine learning methods for communications and signal processing, multimedia signal processing, natural language processing, next generation mobile communications, nonlinear signal processing, optical communications, parallel and distributed processing, and more.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 128 pp. Englisch. Nº de ref. del artículo: 9783031437809

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