Passive Component RF Technology: Materials, Techniques, and Applications - Tapa dura

Pan, Bo; Wang, Guoan

 
9781608071999: Passive Component RF Technology: Materials, Techniques, and Applications
Tapa dura
ISBN 10: 1608071995 ISBN 13: 9781608071999
Editorial: Artech House Publishers, 2011

Sinopsis

This forward-looking resource presents the latest details on smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications. Engineers find comprehensive details on LCP (liquid crystal polymers), metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives.

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Acerca del autor

Guoan Wang is an advisory engineer/scientist at the IBM Semiconductor Research and Development Center in Essex Junction, Vermont. He holds an M.S. in materials science and engineering from Zhejiang University, an M.S. in electrical engineering from Arizona State University, and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology. Bo Pan is a senior RF engineer at Realtek Semiconductor Corporation in Irvine, California. He holds an M.S. in electrical engineering from Tsinghua University and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology.

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Editorial
Artech House Publishers
Año de publicación
2011
Idioma
Inglés
ISBN 10 
1608071995
ISBN 13 
9781608071999
Encuadernación
Tapa dura
Número de páginas
290
Contacto del fabricante
no disponible
Persona responsable
no disponible