Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009: Symposium Held April 14-17, 2009, San Francisco, California, U.s.a. (MRS Proceedings) - Tapa dura

 
9781605111292: Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009: Symposium Held April 14-17, 2009, San Francisco, California, U.s.a. (MRS Proceedings)
Tapa dura
ISBN 10: 1605111295 ISBN 13: 9781605111292
Editorial: Cambridge University Press, 2009

Sinopsis

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

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Reseña del editor

Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.

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Editorial
Cambridge University Press
Año de publicación
2009
Idioma
Inglés
ISBN 10 
1605111295
ISBN 13 
9781605111292
Encuadernación
Tapa dura
Número de páginas
204
Editor
Gall Martin
Contacto del fabricante
no disponible
Persona responsable
Avery
https://www.avery.fr/

chemin des peupliers 27
Dardilly
Francia

Otras ediciones populares con el mismo título

9781107408319: Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)

Edición Destacada

ISBN 10:  1107408318 ISBN 13:  9781107408319
Editorial: Cambridge University Press, 2014
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