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9781489996107: Bond Graph Modelling of Engineering Systems: Theory, Applications and Software Support

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Sinopsis

The author presents current work in bond graph methodology by providing a compilation of contributions from experts across the world that covers theoretical topics, applications in various areas as well as software for bond graph modeling. It addresses readers in academia and in industry concerned with the analysis of multidisciplinary engineering systems or control system design who are interested to see how latest developments in bond graph methodology with regard to theory and applications can serve their needs in their engineering fields. This presentation of advanced work in bond graph modeling presents the leading edge of research in this field. It is hoped that it stimulates new ideas with regard to further progress in theory and in applications.

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De la contraportada

Bond Graph Modelling of Engineering Systems: Theory, Applications and Software Support addresses readers to consider the potential and the state-of-the-art of bond graph modeling of engineering systems with respect to theory, applications and software support. Bond graph modelling is a physical modelling methodology based on first principles that is particularly suited for modelling multidisciplinary or mechatronic systems. This book covers theoretical issues and methodology topics that have been subject of ongoing research during past years, presents new promising applications such as the bond graph modeling of fuel cells and illustrates how bond graph modeling and simulation of mechatronic systems can be supported by software. This up-to-date comprehensive presentation of various topics has been made possible by the cooperation of a group of authors who are experts in various fields and share the bond graph way of thinking.



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Otras ediciones populares con el mismo título

9781441993670: Bond Graph Modelling of Engineering Systems: Theory, Applications and Software Support

Edición Destacada

ISBN 10:  1441993673 ISBN 13:  9781441993670
Editorial: Springer, 2011
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