MAP and TOP: Advanced Manufacturing Communications - Tapa blanda

Sinopsis

1 Introduction.- 2 Current Manufacturing Techniques.- 3 The Network - The Physical Transmission Medium.- 3.1 Basic communications.- 3.2 Communications options.- 3.2.1 Twisted pair.- 3.2.2 Common connecting methods.- 3.2.3 Other twisted-pair systems.- 3.3 Distributed LANs.- 3.3.1 Fibre optics.- 3.3.2 Ethernet.- 3.3.3 Token passing.- 3.3.4 Broadband and baseband.- 3.4 Head ends.- 4 The Seven Layer Model.- 4.1 The application itself.- 4.2 Applications layer (layer 7).- 4.2.1 ACSE, formerly called CASE.- 4.2.2 FTAM.- 4.2.3 MMFS and MMS.- 4.2.4 Other SASE elements.- 4.3 Presentation layer (layer 6).- 4.4 Session layer (layer 5).- 4.5 Transport layer (layer 4).- 4.5.1 Connection-oriented and connectionless communications.- 4.5.2 Error correction.- 4.6 Network layer (layer 3).- 4.7 Datalink layer (layer 2).- 4.8 Physical layer (layer 1).- 4.8.1 Frame lengths.- 4.8.2 Carrier band.- 4.8.3 Enhanced Performance Architecture (EPA).- 4.8.4 Why bother with broadband?.- 4.8.5 Field bus.- 4.9 Interconnecting MAP and TOP with each other and with other systems.- 4.10 Technical and Office Protocols (TOP).- 5 The Standards Scene.- 5.1 The origins of OSI.- 5.2 The International Standards Organization (ISO).- 5.3 ISO stages of development of standards.- 5.4 National activity in the UK.- 5.5 Who's who in standards.- 6 Key Issues.- 6.1 The functionality of MMS.- 6.1.1 CNMA's concerns.- 6.1.2 Migration.- 6.1.3 Companion standards.- 6.1.4 Ambiguities.- 6.2 Interoperability.- 6.3 Testing.- 7 Map and Top Application Case Studies.- 7.1 The Towers of Hanoi and beyond.- 7.1.1 Autofact 1985.- 7.1.2 Lessons learnt.- 7.1.3 The way ahead.- 7.2 Cell controller applications.- 7.2.1 Application 1.- 7.2.2 Application 2.- 7.3 A link from design to assembly and inspection.- 7.4 MAP in the electronics test environment.- 7.5 AIMS - an Assembly Information Management System applied to engine assembly.- 7.5.1 The solution.- 7.5.2 Autonomous operation.- 7.5.3 Real-time response.- 7.5.4 Standardization.- 7.5.5 The future.- 7.6 Using MAP in the factory.- 7.6.1 MAP implementation.- 7.6.2 MAP network access methods.- 7.6.3 Data flow and message traffic.- 7.6.4 MMFS Robot Class 2 - typical messages.- 7.7 MAP in printed circuit board assembly.- 7.8 Communications in the aerospace industry.- 7.9 MAP in General Motors.- 7.9.1 Saginaw.- 7.9.2 The GMT400 Truck and Bus Project.- 8 The Way Ahead.- 8.1 The future.- 8.2 MAP and TOP products.- Useful Addresses.- Abbreviations.- Sources and Recommendations for Further Reading.

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