Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis (Dekker Mechanical Engineering)

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9781420065312: Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis (Dekker Mechanical Engineering)

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated,   includes more detail where needed, and provides additional segments for clarification.

This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest.

Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities.

By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.

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About the Author:

Jamnia & Associates, Chicago, Illinois, USA

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Ali Jamnia
Editorial: CRC Press (2009)
ISBN 10: 1420065319 ISBN 13: 9781420065312
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Descripción CRC Press, 2009. HRD. Estado de conservación: New. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Nº de ref. de la librería FT-9781420065312

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Ali Jamnia
Editorial: Taylor Francis Inc, United States (2009)
ISBN 10: 1420065319 ISBN 13: 9781420065312
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Descripción Taylor Francis Inc, United States, 2009. Hardback. Estado de conservación: New. 2nd Revised edition. Language: English . Brand New Book. As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader s familiarity with the subject nor is it so basic that the reader may lose interest. Dr.Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early 90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design. Nº de ref. de la librería AA69781420065312

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Ali Jamnia
Editorial: Taylor Francis Inc, United States (2009)
ISBN 10: 1420065319 ISBN 13: 9781420065312
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Descripción Taylor Francis Inc, United States, 2009. Hardback. Estado de conservación: New. 2nd Revised edition. Language: English . Brand New Book. As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early 90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design. Nº de ref. de la librería AA69781420065312

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Ali Jamnia
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Descripción Taylor & Francis Inc. Hardback. Estado de conservación: new. BRAND NEW, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis (2nd Revised edition), Ali Jamnia, As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader's familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early '90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system's design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design. Nº de ref. de la librería B9781420065312

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Ali Jamnia
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Descripción Taylor and Francis 2009-01-05, Boca Raton, Fla. |London, 2009. hardback. Estado de conservación: New. Nº de ref. de la librería 9781420065312

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JAMNIA, ALI.
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Descripción CRC Press, 2009. Hardback. Estado de conservación: NEW. 9781420065312 This listing is a new book, a title currently in-print which we order directly and immediately from the publisher. Nº de ref. de la librería HTANDREE0189472

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Jamnia, Ali (Author)
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Descripción CRC, 2008. Hardcover. Estado de conservación: Brand New. 2nd edition. 328 pages. 9.30x6.30x0.90 inches. In Stock. Nº de ref. de la librería __1420065319

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Descripción CRC Press, 2008. Hardcover. Estado de conservación: New. 2. Nº de ref. de la librería DADAX1420065319

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