As the feature size decreases in deep sub-micron designs, coupling capacitance becomes the dominant factor in total capacitance. The resulting crosstalk noise may be responsible for signal integrity issues and significant timing variation. Traditionally, static timing analysis tools have ignored cross coupling effects between wires altogether. Newer tools simply approximate the coupling capacitance by a 2X Miller factor in order to compute the worst case delay. The latter approach not only reduces delay calculation accuracy, but can also be shown to underestimate the delay in certain scenarios.
This book describes accurate but conservative methods for computing delay variation due to coupling. Furthermore, most of these methods are computationally efficient enough to be employed in a static timing analysis tool for complex integrated digital circuits. To achieve accuracy, a more accurate computation of the Miller factor is derived. To achieve both computational efficiency and accuracy, a variety of mechanisms for pruning the search space are detailed, including:
-Spatial pruning - reducing aggressors to those in physical proximity,
-Electrical pruning - reducing aggressors by electrical strength,
-Temporal pruning - reducing aggressors using timing windows,
-Functional pruning - reducing aggressors by Boolean functional analysis.
"Sinopsis" puede pertenecer a otra edición de este libro.
"Finally, a detailed analysis of the silicon interconnect coupling problem! This book not only addresses the coupling noise problem, but formulates and proposes usable CAD algorithms. Since the uncertainty in silicon design performance and reliability due to increasing coupling noise will only get worse each silicon generation, these algorithms will quickly find a gratefulhome in many CAD solutions."
(William J. Grundmann, Intel Fellow, Intel Corporation)
"All signoff analyses - timing, coupling, power, temperature, and reliability - rely on the analysis of crosstalk noise. This book is an important contribution to the field: it provides a synthesis of analytic bounding of crosstalk effects, switching window convergence, and other recent elements of crosstalk methodology. It provides a level of understanding that will be essential for researchers, developers, and users of leading EDA tools going forward."
(Andrew B. Kahng, Professor of CSE and ECE, University of California, San Diego)
As the feature size decreases in deep sub-micron designs, coupling capacitance becomes the dominant factor in total capacitance. The resulting crosstalk noise may be responsible for signal integrity issues and significant timing variation. Traditionally, static timing analysis tools have ignored cross coupling effects between wires altogether. Newer tools simply approximate the coupling capacitance by a 2X Miller factor in order to compute the worst case delay. The latter approach not only reduces delay calculation accuracy, but can also be shown to underestimate the delay in certain scenarios.
This book describes accurate but conservative methods for computing delay variation due to coupling. Furthermore, most of these methods are computationally efficient enough to be employed in a static timing analysis tool for complex integrated digital circuits. To achieve accuracy, a more accurate computation of the Miller factor is derived. To achieve both computational efficiency and accuracy, a variety of mechanisms for pruning the search space are detailed, including:
-Spatial pruning - reducing aggressors to those in physical proximity,
-Electrical pruning - reducing aggressors by electrical strength,
-Temporal pruning - reducing aggressors using timing windows,
-Functional pruning - reducing aggressors by Boolean functional analysis.
"Sobre este título" puede pertenecer a otra edición de este libro.
Librería: Books Puddle, New York, NY, Estados Unidos de America
Condición: New. pp. 132. Nº de ref. del artículo: 26287320
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Librería: Friends of the Library Bookstore, Eau Claire, WI, Estados Unidos de America
The binding is tight and the spine is smooth. The cover has a couple of minor dents along the lower half in front and a slight dent along the front edge, near the middle. The bottom corners are lightly bumped. The pages are clean and unmarked and the book appears to be only lightly used. The previous owned has written their name on the inside of the front cover at the top but there are no other marks inside. From the back cover: "All signoff analyses-timing, coupling, power, temperature, and reliability-rely on the analysis of crosstalk noise. This book is an important contribution to the field." 113 pp. Shelf: W. Nº de ref. del artículo: 251102LW
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Librería: Majestic Books, Hounslow, Reino Unido
Condición: New. pp. 132 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam. Nº de ref. del artículo: 7593351
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Condición: New. pp. 132. Nº de ref. del artículo: 18287314
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Hardcover. Condición: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less. Nº de ref. del artículo: G1402080913I4N00
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Condición: New. Nº de ref. del artículo: 3401008-n
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Librería: Romtrade Corp., STERLING HEIGHTS, MI, Estados Unidos de America
Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide. Nº de ref. del artículo: ABNR-91689
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Librería: Basi6 International, Irving, TX, Estados Unidos de America
Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Nº de ref. del artículo: ABEOCT25-155598
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Librería: Ria Christie Collections, Uxbridge, Reino Unido
Condición: New. In. Nº de ref. del artículo: ria9781402080913_new
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