This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.
"Sinopsis" puede pertenecer a otra edición de este libro.
From the reviews:
"Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. ... Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.
"Sobre este título" puede pertenecer a otra edición de este libro.
Librería: Basi6 International, Irving, TX, Estados Unidos de America
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Librería: Romtrade Corp., STERLING HEIGHTS, MI, Estados Unidos de America
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Librería: Majestic Books, Hounslow, Reino Unido
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Librería: Biblios, Frankfurt am main, HESSE, Alemania
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Librería: moluna, Greven, Alemania
Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technologyDetailed description and working receipts (know-how) of KOH etching and . Nº de ref. del artículo: 4093790
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