Reliability Prediction for Microelectronics (Quality and Reliability Engineering Series) - Tapa dura

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JOSEPH B. BERNSTEIN, PHD, is Director of the Laboratory for Failure Analysis and Reliability of Electronic Systems at Ariel University, Israel. He has worked and published extensively on failure analysis and defect avoidance in microelectronics, and is a senior member of IEEE.

ALAIN A. BENSOUSSAN, PHD, is a Consulting Reliability Engineer with decades of experience as an Expert on Optics and Opto-Electronics Parts at Thales Alenia Space. He has conducted research in many areas of microelectronics reliability and physics of failure.

EMMANUEL BENDER, PHD, completed his PhD in Electrical and Electronics Engineering, specializing in Microelectronics Reliability, at Ariel University, Israel, in 2022.

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Wiley Series in Quality & Reliability Engineering

RELIABILITY PREDICTION FOR MICROELECTRONICS

REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK

Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability.

Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing.

Reliability Prediction for Microelectronics readers will also find:

• Focus on the tools required to perform reliability assessments in real operating conditions
• Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more
• New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI

Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.