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Obstacles to Systemic Innovation: An Illustration From Semiconductor Manufacturing Technology (Classic Reprint) - Tapa blanda

Rappa, Michael A.

 
9781332272495: Obstacles to Systemic Innovation: An Illustration From Semiconductor Manufacturing Technology (Classic Reprint)

Sinopsis

Excerpt from Obstacles to Systemic Innovation: An Illustration From Semiconductor Manufacturing Technology

Fig. 2. Increasing cost of advanced semiconductor manufacturing facilities. Assuming 800 150mm wafer Starts per day (tolliver, In essence, microenvironment technology is a wafer transport and storage sys tem consisting of an integrated collection of robotics, automation techniques, tool enclosures, and wafer pods that are used to maintain the wafers in a Class 1 (i.e one 0.5},lm particle per cubic foot) ambient. Even so, it is not an especially com plex technology in the usual sense of the term. Indeed, microenvironment technol ogy is fairly straightforward in nature. It consists of nothing more than conventional manufacturing enclosures and robotics for handling and transporting wafers. The radical quality of microenvironment technology is n0t in its complexity, but in the way it alters how manufacturers must think about the wafer processing system.

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Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com

This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.

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Excerpt from Obstacles to Systemic Innovation: An Illustration From Semiconductor Manufacturing Technology

Fig. 2. Increasing cost of advanced semiconductor manufacturing facilities. Assuming 800 150mm wafer Starts per day (tolliver, In essence, microenvironment technology is a wafer transport and storage sys tem consisting of an integrated collection of robotics, automation techniques, tool enclosures, and wafer pods that are used to maintain the wafers in a Class 1 (i.e one 0.5},lm particle per cubic foot) ambient. Even so, it is not an especially com plex technology in the usual sense of the term. Indeed, microenvironment technol ogy is fairly straightforward in nature. It consists of nothing more than conventional manufacturing enclosures and robotics for handling and transporting wafers. The radical quality of microenvironment technology is n0t in its complexity, but in the way it alters how manufacturers must think about the wafer processing system.

About the Publisher

Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com

This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.

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Excerpt from Obstacles to Systemic Innovation: An Illustration From Semiconductor Manufacturing Technology

Microenvironment technology holds significant potential for enabling the cost-effective production of semiconductor integrated circuits. However, integrated circuit manufacturers have been reluctant to adopt the technology even though there is substantial empirical evidence of its effectiveness. This paper suggests that the slow acceptance of microenvironment technology can be understood in terms of its weak appropriability and systemic nature.

The history of semiconductor technology has been aptly called a "revolution in miniature" (Braun and Macdonald, 1978). This is because the principal goal, miniaturization, is to design circuits with the thinnest possible line widths, thereby permitting the greatest possible degree of circuit integration on a single chip. The sophistication of semiconductors today is attributable in large part to the success of scientists and engineers in pushing line features to their physical limits. According to the Semiconductor Industry Association, future generations of Drams will have less than one-half micron feature sizes (see Table 1).

The relationship between line geometry and circuit density places stringent demands on the manufacturing discipline necessary to meet the tolerances of submicron devices. Particle contamination during wafer processing, in particular, can cause defects on the wafer surface that have a substantial effect on reducing chip yield. Figure 1 illustrates the empirical relationship between the number of defects per square centimeter on a wafer and test yield for 16-megabit DRAM wafer processing.

About the Publisher

Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com

This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.

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9781314726657: Obstacles to systemic innovation: an illustration from semiconductor manufacturing technology...

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ISBN 10:  131472665X ISBN 13:  9781314726657
Editorial: HardPress Publishing, 2013
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