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Packaging and Embedded Electronics for the Next Generation - Tapa blanda

Sampson, Michael J.

 
9781289250560: Packaging and Embedded Electronics for the Next Generation
Tapa blanda
ISBN 10: 1289250561 ISBN 13: 9781289250560
Editorial: BiblioGov, 2013

Sinopsis

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

"Sinopsis" puede pertenecer a otra edición de este libro.

Reseña del editor

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
BiblioGov
Año de publicación
2013
Idioma
Inglés
ISBN 10 
1289250561
ISBN 13 
9781289250560
Encuadernación
Tapa blanda
Número de páginas
24
Contacto del fabricante
no disponible
Persona responsable
no disponible