LTE and the Evolution to 4G Wireless: Design and Measurement Challenges - Tapa dura

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Moray Rumney, Lead Technologist, Agilent Technologies, USA Moray Rumney has enjoyed a varied career path, spanning manufacturing engineering, product development, applications engineering, and most recently technical marketing. His main focus has been the development and system design of base station emulators used in the development and testing of cellular phones. Moray currently represents Agilent at RAN WG4, developing the air interface for HSPA+ and LTE. He has published many technical articles in the field of cellular communications and is a regular speaker and chairman at industry conferences

Agilent Technologies A leader in test and measurement solutions, Agilent Technologies is at the forefront of emerging wireless and broadband markets. With up-to-date, reliable LTE design automation and test solutions, it provides the most complete measurement coverage - from RF to digital - throughout the product development cycle. Agilent design and test products are based on the company's knowledge gained through active participation in the relevant 3GPP working groups. Agilent's engineers have already produced one of the industry's first and most extensive lines of WiMAX solutions. 

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The Next generation: Wireless Communications for Multimedia and Beyond

From both a technical and a practical point of view, there is still much to examine, evaluate and understand in 3GPP LTE cellular technology along with its evolution to LTE-Advanced. The first edition of this book, with content from Agilent engineers and other industry experts, covered basic concepts such as OFDMA, MMO and SC-FDMA. This second edition adds more detail on LTE and LTE-Advanced including the changes to the physical layer and upper layer signaling.

New material on LTE-Advanced testing has been added to the section on design and verification challenges along with much more on MMO testing and advanced performance testing of receivers and transmitters. The latest information on RF and signaling conformance testing is delivered by authors participating in the 3GPP standards committees and a new section on non-signaling manufacturing test outlines what's needed to lower manufacturing costs.