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Wireless Interface Technologies for 3D IC and Module Integration - Tapa dura

Kuroda, Tadahiro; Yip, Wai-Yeung

 
9781108841214: Wireless Interface Technologies for 3D IC and Module Integration
Tapa dura
ISBN 10: 110884121X ISBN 13: 9781108841214
Editorial: Cambridge University Press, 2021

Sinopsis

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

"Sinopsis" puede pertenecer a otra edición de este libro.

Acerca de los autores

Tadahiro Kuroda is Professor and Founding Director at the Systems Design Lab at the University of Tokyo. He is a Fellow of the IEICE and the IEEE.

Wai-Yeung Yip is a Researcher at the University of Tokyo with over twenty-five years of industry experience in high-speed chip interface design.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Cambridge University Press
Año de publicación
2021
Idioma
Inglés
ISBN 10 
110884121X
ISBN 13 
9781108841214
Encuadernación
Tapa dura
Número de páginas
336
Contacto del fabricante
no disponible
Persona responsable
gpsr@libri.de
gpsr@libri.de

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