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LCP for Microwave Packages and Modules Hardback (The Cambridge RF and Microwave Engineering Series) - Tapa dura

Libro 7 de 20: Cambridge RF and Microwave Engineering

Pham; Chen; Aihara

 
9781107003781: LCP for Microwave Packages and Modules Hardback (The Cambridge RF and Microwave Engineering Series)
Tapa dura
ISBN 10: 1107003784 ISBN 13: 9781107003781
Editorial: Cambridge University Press, 2012

Sinopsis

A comprehensive overview of RF microelectronic design using Liquid Crystal Polymer (LCP) at package, component and system levels.

"Sinopsis" puede pertenecer a otra edición de este libro.

Acerca de los autores

Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 2010–2012.

Morgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz.

Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Cambridge University Press
Año de publicación
2012
Idioma
Inglés
ISBN 10 
1107003784
ISBN 13 
9781107003781
Encuadernación
Tapa dura
Número de páginas
266
Contacto del fabricante
no disponible
Persona responsable
Avery
https://www.avery.fr/

chemin des peupliers 27
Dardilly
Francia