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3D Integration of Resistive Switching Memory (Frontiers in Semiconductor Technology) - Tapa blanda

 
9781032489506: 3D Integration of Resistive Switching Memory (Frontiers in Semiconductor Technology)
Tapa blanda
ISBN 10: 1032489502 ISBN 13: 9781032489506
Editorial: CRC Press, 2024

Sinopsis

This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications.

Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts:

1: Associative Problems in Crossbar array and 3D architectures;
2: Selector Devices and Self-Selective Cells;
3: Integration of 3D RRAM;
4: Reliability Issues in 3D RRAM;
5: Applications of 3D RRAM beyond Storage.

The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.

"Sinopsis" puede pertenecer a otra edición de este libro.

Acerca del autor

Qing Luo received his Ph.D. from the Institute of Microelectronics, Chinese Academy of Sciences (IMECAS), Beijing, China, in 2017. He is currently Professor at the Key Laboratory of Microelectronics Devices and Integrated Technology in IMECAS. His research interests are emerging memory devices including resistive RAM devices and ferroelectric memory devices.

De la contraportada

This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures, to its applications.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
CRC Press
Año de publicación
2024
Idioma
Inglés
ISBN 10 
1032489502
ISBN 13 
9781032489506
Encuadernación
Tapa blanda
Número de edición
1
Número de páginas
98
Editor
Luo Qing
Contacto del fabricante
Taylor and Francis, GPSR Taylor and Francis
gpsr@taylorandfrancis.com

Taylor & Francis Verlag GmbH, Kaufingerstraße 24
München
80331
Alemania