Artículos relacionados a Micro Electronic Packing Technology: Materials and...
Sinopsis
Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno
"Sinopsis" puede pertenecer a otra edición de este libro.
Reseña del editor
Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno
"Sobre este título" puede pertenecer a otra edición de este libro.
Resultados de la búsqueda para Micro Electronic Packing Technology: Materials and...
Imagen de archivo
Microelectronic Packaging Technology: Materials and Processes : Proceedings of the 2nd Asm International Electronic Materials and Processing Congres
Librería: HPB-Diamond, Dallas, TX, Estados Unidos de America
Calificación del vendedor: 5 de 5 estrellas
hardcover. Condición: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority! Nº de ref. del artículo: S_480848251
Comprar usado
EUR 37,90
Envío por EUR 3,23
Se envía dentro de Estados Unidos de America
Se envía dentro de Estados Unidos de America
Cantidad disponible: 1 disponibles