Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis (Mechanical Engineering) - Tapa dura

Libro 24 de 115: Mechanical Engineering

Jamnia, Ali

 
9780824708658: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis (Mechanical Engineering)
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ISBN 10: 0824708652 ISBN 13: 9780824708658
Editorial: CRC Press, 2002

Sinopsis

Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.

Practical Guide to the Packaging of Electronics discusses

  • Packaging/enclosure design and reliability
  • Thermal, junction-to-case, and contact interface resistance
  • Direct and indirect flow system design
  • Fin design and fan selection
  • Vital elements of shock and vibration
  • Thermal stresses and strains in the design and analysis of mechanically reliable systems
  • Reliability models and system failure
  • The selection of engineering software to facilitate system analysis
  • Design parameters in an avionics electronics package

    Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.

    • "Sinopsis" puede pertenecer a otra edición de este libro.

    Críticas

    "Anyone looking to learn quickly about the fundamentals of basic thermal heat transfer and vibration needs this book. The author has written a concise practical book intended for all engineers who need to understand the fundamentals of heat transfer and mechanical vibration, especially in electronics and electronics packaging. Engineers who need to perform back-of-the-envelope calculations for heat transfer or vibration problems will find this book to be an excellent resource. The material is written for quick learning and is geared for applying to practical problems encountered by engineers." - IEEE Electrical Insulation, Vol. 20, No. 2, March/April 2004 Promo Copy

    Reseña del editor

    Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.

    Practical Guide to the Packaging of Electronics discusses

  • Packaging/enclosure design and reliability
  • Thermal, junction-to-case, and contact interface resistance
  • Direct and indirect flow system design
  • Fin design and fan selection
  • Vital elements of shock and vibration
  • Thermal stresses and strains in the design and analysis of mechanically reliable systems
  • Reliability models and system failure
  • The selection of engineering software to facilitate system analysis
  • Design parameters in an avionics electronics package

    Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.

    • "Sobre este título" puede pertenecer a otra edición de este libro.

    Editorial
    CRC Press
    Año de publicación
    2002
    Idioma
    Inglés
    ISBN 10 
    0824708652
    ISBN 13 
    9780824708658
    Encuadernación
    Tapa dura
    Número de edición
    1
    Número de páginas
    224
    Contacto del fabricante
    no disponible
    Persona responsable
    no disponible

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    Tapa dura