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Sinopsis
This book describes hardening of semiconductor components against radiation and temperature. Basic mechanisms of radiation effects on electronic materials and devices are discussed first, followed by such practical topics as hardening technologies, circuit design for hardening, and, finally, hardness assurance. Discussions center mainly on silicon technology.
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Reseña del editor
This book describes hardening of semiconductor components against radiation and temperature. Basic mechanisms of radiation effects on electronic materials and devices are discussed first, followed by such practical topics as hardening technologies, circuit design for hardening, and, finally, hardness assurance. Discussions center mainly on silicon technology.
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HARDENING SEMICONDUCTOR COMPONENTS AGAINST RADIATION AND TEMPERATURE.
Publicado por
Noyes Data Corporation, Park Ridge, 1989
ISBN 10: 0815512120
ISBN 13: 9780815512127
Antiguo o usado
Tapa dura
Librería: SUNSET BOOKS 2, Newark, OH, Estados Unidos de America
Calificación del vendedor: 5 de 5 estrellas
Hardcover. Condición: Good. No Jacket. First. 328pp, w/full markings, pocket, wear/soil. Weight is 3.5 lb. Ex-Library Size: 4to. Book. Nº de ref. del artículo: 013674
Comprar usado
EUR 86,28
Envío por EUR 6,46
Se envía dentro de Estados Unidos de America
Se envía dentro de Estados Unidos de America
Cantidad disponible: 1 disponibles