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Sinopsis
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
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Reseña del editor
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
"Sobre este título" puede pertenecer a otra edición de este libro.
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High-Frequency Characterization of Electronic Packaging
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High-Frequency Characterization of Electronic Packaging
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High-Frequency Characterization of Electronic Packaging (Electronic Packaging and Interconnects, 1)
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High-Frequency Characterization of Electronic Packaging
Impresión bajo demandaLibrería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples. 174 pp. Englisch. Nº de ref. del artículo: 9780792383079
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High-frequency Characterization of Electronic Packaging
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Kluwer Academic Publishers, 1998
ISBN 10: 0792383079
ISBN 13: 9780792383079
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Condición: New. Offers an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. Series: Electronic Packaging and Interconnects. Num Pages: 158 pages, biography. BIC Classification: TJFN. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 426. . 1998. Hardback. . . . . Nº de ref. del artículo: V9780792383079
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High-Frequency Characterization of Electronic Packaging
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High-Frequency Characterization of Electronic Packaging (Electronic Packaging and Interconnects, 1)
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Condición: New. In English. Nº de ref. del artículo: ria9780792383079_new
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High-Frequency Characterization of Electronic Packaging
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Condición: As New. Unread book in perfect condition. Nº de ref. del artículo: 269316
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High-Frequency Characterization of Electronic Packaging
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Gebunden. Condición: New. High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-spee. Nº de ref. del artículo: 5970823
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