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Sinopsis
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
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Reseña del editor
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
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High-Frequency Characterization of Electronic Packaging: 1 (Electronic Packaging and Interconnects, 1)
Librería: Bahamut Media, Reading, Reino Unido
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hardcover. Condición: Very Good. Shipped within 24 hours from our UK warehouse. Clean, undamaged book with no damage to pages and minimal wear to the cover. Spine still tight, in very good condition. Remember if you are not happy, you are covered by our 100% money back guarantee. Nº de ref. del artículo: 6545-9780792383079
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High-Frequency Characterization of Electronic Packaging
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High-Frequency Characterization of Electronic Packaging (Hardcover)
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Kluwer Academic Publishers, Dordrecht, 1998
ISBN 10: 0792383079
ISBN 13: 9780792383079
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Hardcover. Condición: new. Hardcover. High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Nº de ref. del artículo: 9780792383079
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High-Frequency Characterization of Electronic Packaging (Electronic Packaging and Interconnects, 1)
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High-Frequency Characterization of Electronic Packaging
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High-Frequency Characterization of Electronic Packaging (Electronic Packaging and Interconnects, 1)
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High-Frequency Characterization of Electronic Packaging
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High-Frequency Characterization of Electronic Packaging
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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples. 174 pp. Englisch. Nº de ref. del artículo: 9780792383079
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High-Frequency Characterization of Electronic Packaging
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Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-spee. Nº de ref. del artículo: 5970823
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High-frequency Characterization of Electronic Packaging
Publicado por
Kluwer Academic Publishers, 1998
ISBN 10: 0792383079
ISBN 13: 9780792383079
Nuevo
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Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
Calificación del vendedor: 5 de 5 estrellas
Condición: New. Offers an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. Series: Electronic Packaging and Interconnects. Num Pages: 158 pages, biography. BIC Classification: TJFN. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 426. . 1998. Hardback. . . . . Nº de ref. del artículo: V9780792383079
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