Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development - Tapa dura

Wei-Ting Kary Chien, Kary Chien; Way Kuo, Kuo; Kuo, Way

 
9780792381075: Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
Tapa dura
ISBN 10: 0792381076 ISBN 13: 9780792381075
Editorial: Springer, 1998

Sinopsis

The international market is very competitive for high-tech manufacturers to­ day. Achieving competitive quality and reliability for products requires leader­ ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de­ sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur­ ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970’s, one of the world’s largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in­ dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.

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Reseña del editor

The international market is very competitive for high-tech manufacturers to­ day. Achieving competitive quality and reliability for products requires leader­ ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de­ sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur­ ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: · the economic impact of employing the microelectronics fabricated by in­ dustry, · a study of the relationship between reliability and yield, · the progression toward miniaturization and higher reliability, and · the correctness and complexity of new system designs, which include a very significant portion of software.

Reseña del editor

Reliability, Yield, and Stress Burn-In explains reliability issues in Microelectronics Systems Manufacturing and Software Development with an emphasis on evolving manufacturing technology for the semiconductor industry. Since most microelectronics components have an infant mortality period of about one year under ordinary operating conditions, and many modern systems, such as PCs, are heavily used in the first few years, the reliability problem in the infant mortality period becomes extremely important. Burn-in is an accelerated screening procedure that eliminates infant mortalities early on in the shop before shipping out the products to the customers. This book will also help readers to analyze systems that exhibit high failure rate during a long infant mortality period.
Reliability, Yield, and Stress Burn-In presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels. Various statistical methods are addressed including parametric, nonparametric, and Bayesian approaches. Many case studies are introduced in combination with the developed theories. Included in the book is an introduction to software reliability.
Reliability, Yield, and Stress Burn-In will help manufacturers and system designers to understand and to design a more reliable product given constraints specified by the users and designers. An understanding of the infant mortality period will solve many reliability problems, including those faced in the semiconductor industry and software industry.

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Editorial
Springer
Año de publicación
1998
Idioma
Inglés
ISBN 10 
0792381076
ISBN 13 
9780792381075
Encuadernación
Tapa dura
Número de páginas
428
Contacto del fabricante
no disponible
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Alemania

Otras ediciones populares con el mismo título

9781461375968: Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development

Edición Destacada

ISBN 10:  1461375967 ISBN 13:  9781461375968
Editorial: Springer, 2014
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