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Lead-free Solders: Materials Reliability for Electronics (Wiley Series in Materials for Electronic & Optoelectronic Applications) - Tapa dura
Sinopsis
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:
- Phase diagrams and alloy development
- Effect of minor alloying additions
- Composite approaches including nanoscale reinforcements
- Mechanical issues affecting reliability
- Reliability under impact loading
- Thermomechanical fatigue
- Chemical issues affecting reliability
- Whisker growth
- Electromigration
- Thermomigration
Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
"Sinopsis" puede pertenecer a otra edición de este libro.
Acerca del autor
K. N. Subramanian is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders.
De la contraportada
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:
- Phase diagrams and alloy development
- Effect of minor alloying additions
- Composite approaches including nanoscale reinforcements
- Mechanical issues affecting reliability
- Reliability under impact loading
- Thermomechanical fatigue
- Chemical issues affecting reliability
- Whisker growth
- Electromigration
- Thermomigration
Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.
"Sobre este título" puede pertenecer a otra edición de este libro.
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Lead-Free Solders : Materials Reliability for Electronics
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Lead-Free Solders
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Lead-free Solders
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Gebunden. Condición: New. K. N. Subramanian is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders. Nº de ref. del artículo: 556559346
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Lead-Free Solders : Materials Reliability for Electronics
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Lead-free Solders: Materials Reliability for Electronics (Wiley Series in Materials for Electronic & Optoelectronic Applications)
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Wiley-Blackwell 2012-03-09, 2012
ISBN 10: 0470971827
ISBN 13: 9780470971826
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Lead-free Solders: Materials Reliability for Electronics Format: Hardcover
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Lead-free Solders
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John Wiley and Sons Ltd, 2012
ISBN 10: 0470971827
ISBN 13: 9780470971826
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Condición: New. Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Editor(s): Subramanian, Kanakasabapathi. Series: Wiley Series in Materials for Electronic & Optoelectronic Applications. Num Pages: 520 pages, Illustrations. BIC Classification: TGM; TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 174 x 28. Weight in Grams: 934. . 2012. 1st Edition. Hardcover. . . . . Nº de ref. del artículo: V9780470971826
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