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Sinopsis
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
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Reseña del editor
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
"Sobre este título" puede pertenecer a otra edición de este libro.
- EditorialSpringer
- Año de publicación1994
- ISBN 10 0442014414
- ISBN 13 9780442014414
- EncuadernaciónTapa dura
- IdiomaInglés
- Número de páginas580
- Contacto del fabricanteno disponible
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Librería: Bay State Book Company, North Smithfield, RI, Estados Unidos de America
Calificación del vendedor: 5 de 5 estrellas
Condición: acceptable. The book is complete and readable, with all pages and cover intact. Dust jacket, shrink wrap, or boxed set case may be missing. Pages may have light notes, highlighting, or minor water exposure, but nothing that affects readability. May be an ex-library copy and could include library markings or stickers. Nº de ref. del artículo: BSM.IM4G
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Librería: Toscana Books, AUSTIN, TX, Estados Unidos de America
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Hardcover. Condición: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks. Nº de ref. del artículo: Scanned0442014414
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering) [Hardcover] Lau, John H.
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
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Chip on Board: Technology for Multichip Modules
Librería: moluna, Greven, Alemania
Calificación del vendedor: 5 de 5 estrellas
Gebunden. Condición: New. This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and. Nº de ref. del artículo: 458435639
Cantidad disponible: Más de 20 disponibles
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
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Chip on Board : Technology for Multichip Modules
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Calificación del vendedor: 5 de 5 estrellas
Buch. Condición: Neu. Neuware - This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection. Nº de ref. del artículo: 9780442014414
Cantidad disponible: 2 disponibles